YH 946 A‑III Touch Separator | Precision PCB IC & BGA Removal Tool

The YH 946 A‑III Touch Separator is a professional precision tool designed for safely lifting and removing BGA, QFP, SOIC, and other surface‑mount IC chips from printed circuit boards. Featuring an advanced touch separation mechanism, this tool provides controlled and precise component removal without harming the board.

With adjustable pressure control and an ergonomic, durable build, the YH 946 A‑III Touch Separator delivers reliable performance for technicians, repair professionals, and electronics hobbyists. It’s ideal for use in mobile phone repair, motherboard servicing, and advanced PCB rework tasks.

Ideal for: BGA removal, IC lift, PCB repair, mobile phone servicing, and precision electronics work.

Key Features

1. Advanced touch separation mechanism for safe IC removal
2. Adjustable pressure control for accuracy
3. Ergonomic and durable construction
4. Precision lifting for BGA, QFP, SOIC and other SMD chips
5. Suitable for labs, workshops, and professional repair centers
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