YH 946D‑III Touch Separator | Precision PCB IC & BGA Removal Tool

The YH 946D‑III Touch Separator is a professional precision tool designed to safely lift and remove BGA, QFP, SOIC, and other surface‑mount IC chips from printed circuit boards. Featuring an advanced touch separation mechanism, this tool provides controlled and accurate component removal without damaging the board.

With adjustable pressure control and a sturdy ergonomic design, the YH 946D‑III Touch Separator delivers reliable performance for electronics technicians, repair centers, and hobbyists alike. It is ideal for use in mobile phone repair, motherboard servicing, and advanced PCB rework applications.

Ideal for: BGA removal, IC lift, PCB rework, mobile repair, and precision electronics tasks.

 Key Features

1. Advanced touch separation mechanism for safe IC removal
2. Adjustable pressure control for precision
3. Ergonomic and durable build
4. Precise, controlled component lifting
5. Works with BGA, QFP, SOIC and other SMD chips
6. Suitable for labs, workshops, and professional repair centers
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